Automated 3D-Mounting on MID
For optimization of product design
Higher design flexibility
Miniaturization/ Weight Reduction
Greater functional density
What is MID and 3D mounting?
MID (Molded Interconnect Device) is an injection molded component with integrated circuit traces. With our 3D mounting technology, microelectronic components can be mounted even on non-planer surfaces of MID. MID and 3D-mounting technology provides substantial benefits to product designers who needs to achieve design freedom and/ or to reduce device size/ weight while integrating necessary functions into the device.